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The Ministry of Industry and Information Technology is formulating a sensor development plan-MEMS welcomes new opportunities

(Summary description)  The Internet of Things (IOT), smart hardware, automotive electronics, and Industry 4.0 have brought huge market opportunities to sensors. At the "3rd Global Sensor Summit Forum and China Internet of Things Application Summit" that ended yesterday, how sensors become the "eagle" instead of the "pig" on the "outlet" has become the focus of heated discussion and attention by many participating experts. According to industry insiders, based on huge opportunities and fragmented market demand, MEMS sensors have become a new opportunity for sensor development, and platform companies focusing on serving small and medium-sized companies have begun to emerge.   As the most important component of the perception layer of the Internet of Things, sensors have become one of the focus of policy support. At the forum, Ding Wenwu, general manager of the National Integrated Circuit Industry Investment Fund (hereinafter referred to as the "big fund"), said that the big fund will support the development of the Internet of Things, focusing on investment in sensors, MEMS sensors and other fields. Ren Aiguang, director of the Integrated Circuit Division of the Electronics Department of the Ministry of Industry and Information Technology, revealed that the Ministry of Industry and Information Technology is formulating a sensor development plan, which will be released soon.       "Although after nearly ten years of development, we have initially constructed the sensor industry chain, we still face great challenges." Sun Yuwang, president of SMIC Juyuan Equity Investment Management Co., Ltd. (hereinafter referred to as "SMIC Juyuan"), believes that China's sensors face Four major challenges: Products are in the follow-up stage, product indicators and reliability are lagging behind similar foreign products, and R&D capabilities need to be greatly improved; products are concentrated on the low-end, small in scale, and domestic sensor manufacturers are generally weak in profitability; the industrial chain is incomplete and the industry The coordination ability is weak, and the ability of sensors and MEMS manufacturing links needs to be strengthened urgently; in the key capabilities of future sensor development, the multi-sensing fusion of hardware, software algorithms, low power consumption, and intelligence are generally lacking in China.   According to data from market consulting agency Yole, the world's top 30 companies in the MEMS field account for 80% of the industry's economic profits, while only four local companies in China, including Goertek, AAC Technologies, and Wuxi Meixin, have made the top 30.   "From an industrial perspective, independent research and development cannot be overemphasized." In Sun Yuwang's view, mergers and acquisitions can indeed accelerate the development of the industry, but based on the success rate of mergers and acquisitions only 20%, if you want to develop China's sensor industry, To be based on independent research and development.   Based on his own experience, Xue Songsheng, chairman and CEO of Duowei Technology, believes that China has a greater gap with the international advanced level in sensor processing and manufacturing. In this regard, Sun Yuwang believes that manufacturing is an inevitable hurdle for the leap-forward development of China's sensor industry. "Domestic-designed products cannot be manufactured in China. They must be manufactured in Europe, America, Japan and South Korea. This leads to high costs and severely affects competitiveness. If Chinese sensors want to be internationally competitive, they must speed up the construction of their own manufacturing capabilities." Sun Yuwang He and Xue Songsheng both stated that based on the enlightenment of Bosch and others, the IDM model is a better model for the development of China's sensor industry.   Fortunately, SMIC has already achieved mass production of oscillators, accelerometers, microphones, pressure sensors and other products. Radio frequency devices have already been shipped, and gyroscopes are also under development.   Liu Zewen, a professor at the Institute of Microelectronics of Tsinghua University, said that packaging has become a bottleneck in China's sensor development. The current challenge is: how to package RF MEMS sensors, package MEMS (microelectromechanical system), IC (integrated circuit) and wireless communication (wireless) into SOC chips, and meet the requirements of "low power consumption, low cost, and small size". "And other requirements.     MEMS sensors welcome new opportunities   In a list of "12 disruptive technologies that determine the future economy", the Internet of Things, advanced robots, and autonomous vehicles are all on the list, and the core and foundation of these technologies are sensors. "In the robot, the most important thing is the sensor." said Li Lijun, executive vice president and chairman of Cixing Co., Ltd.   By integrating MEMS (Micro Electro Mechanical System) and

The Ministry of Industry and Information Technology is formulating a sensor development plan-MEMS welcomes new opportunities

(Summary description)  The Internet of Things (IOT), smart hardware, automotive electronics, and Industry 4.0 have brought huge market opportunities to sensors. At the "3rd Global Sensor Summit Forum and China Internet of Things Application Summit" that ended yesterday, how sensors become the "eagle" instead of the "pig" on the "outlet" has become the focus of heated discussion and attention by many participating experts. According to industry insiders, based on huge opportunities and fragmented market demand, MEMS sensors have become a new opportunity for sensor development, and platform companies focusing on serving small and medium-sized companies have begun to emerge.

  As the most important component of the perception layer of the Internet of Things, sensors have become one of the focus of policy support. At the forum, Ding Wenwu, general manager of the National Integrated Circuit Industry Investment Fund (hereinafter referred to as the "big fund"), said that the big fund will support the development of the Internet of Things, focusing on investment in sensors, MEMS sensors and other fields. Ren Aiguang, director of the Integrated Circuit Division of the Electronics Department of the Ministry of Industry and Information Technology, revealed that the Ministry of Industry and Information Technology is formulating a sensor development plan, which will be released soon.

 



 

  "Although after nearly ten years of development, we have initially constructed the sensor industry chain, we still face great challenges." Sun Yuwang, president of SMIC Juyuan Equity Investment Management Co., Ltd. (hereinafter referred to as "SMIC Juyuan"), believes that China's sensors face Four major challenges: Products are in the follow-up stage, product indicators and reliability are lagging behind similar foreign products, and R&D capabilities need to be greatly improved; products are concentrated on the low-end, small in scale, and domestic sensor manufacturers are generally weak in profitability; the industrial chain is incomplete and the industry The coordination ability is weak, and the ability of sensors and MEMS manufacturing links needs to be strengthened urgently; in the key capabilities of future sensor development, the multi-sensing fusion of hardware, software algorithms, low power consumption, and intelligence are generally lacking in China.

  According to data from market consulting agency Yole, the world's top 30 companies in the MEMS field account for 80% of the industry's economic profits, while only four local companies in China, including Goertek, AAC Technologies, and Wuxi Meixin, have made the top 30.

  "From an industrial perspective, independent research and development cannot be overemphasized." In Sun Yuwang's view, mergers and acquisitions can indeed accelerate the development of the industry, but based on the success rate of mergers and acquisitions only 20%, if you want to develop China's sensor industry, To be based on independent research and development.

  Based on his own experience, Xue Songsheng, chairman and CEO of Duowei Technology, believes that China has a greater gap with the international advanced level in sensor processing and manufacturing. In this regard, Sun Yuwang believes that manufacturing is an inevitable hurdle for the leap-forward development of China's sensor industry. "Domestic-designed products cannot be manufactured in China. They must be manufactured in Europe, America, Japan and South Korea. This leads to high costs and severely affects competitiveness. If Chinese sensors want to be internationally competitive, they must speed up the construction of their own manufacturing capabilities." Sun Yuwang He and Xue Songsheng both stated that based on the enlightenment of Bosch and others, the IDM model is a better model for the development of China's sensor industry.

  Fortunately, SMIC has already achieved mass production of oscillators, accelerometers, microphones, pressure sensors and other products. Radio frequency devices have already been shipped, and gyroscopes are also under development.

  Liu Zewen, a professor at the Institute of Microelectronics of Tsinghua University, said that packaging has become a bottleneck in China's sensor development. The current challenge is: how to package RF MEMS sensors, package MEMS (microelectromechanical system), IC (integrated circuit) and wireless communication (wireless) into SOC chips, and meet the requirements of "low power consumption, low cost, and small size". "And other requirements.

 

  MEMS sensors welcome new opportunities

  In a list of "12 disruptive technologies that determine the future economy", the Internet of Things, advanced robots, and autonomous vehicles are all on the list, and the core and foundation of these technologies are sensors. "In the robot, the most important thing is the sensor." said Li Lijun, executive vice president and chairman of Cixing Co., Ltd.

  By integrating MEMS (Micro Electro Mechanical System) and

Information

  The Internet of Things (IOT), smart hardware, automotive electronics, and Industry 4.0 have brought huge market opportunities to sensors. At the "3rd Global Sensor Summit Forum and China Internet of Things Application Summit" that ended yesterday, how sensors become the "eagle" instead of the "pig" on the "outlet" has become the focus of heated discussion and attention by many participating experts. According to industry insiders, based on huge opportunities and fragmented market demand, MEMS sensors have become a new opportunity for sensor development, and platform companies focusing on serving small and medium-sized companies have begun to emerge.

  As the most important component of the perception layer of the Internet of Things, sensors have become one of the focus of policy support. At the forum, Ding Wenwu, general manager of the National Integrated Circuit Industry Investment Fund (hereinafter referred to as the "big fund"), said that the big fund will support the development of the Internet of Things, focusing on investment in sensors, MEMS sensors and other fields. Ren Aiguang, director of the Integrated Circuit Division of the Electronics Department of the Ministry of Industry and Information Technology, revealed that the Ministry of Industry and Information Technology is formulating a sensor development plan, which will be released soon.
 
 
  "Although after nearly ten years of development, we have initially constructed the sensor industry chain, we still face great challenges." Sun Yuwang, president of SMIC Juyuan Equity Investment Management Co., Ltd. (hereinafter referred to as "SMIC Juyuan"), believes that China's sensors face Four major challenges: Products are in the follow-up stage, product indicators and reliability are lagging behind similar foreign products, and R&D capabilities need to be greatly improved; products are concentrated on the low-end, small in scale, and domestic sensor manufacturers are generally weak in profitability; the industrial chain is incomplete and the industry The coordination ability is weak, and the ability of sensors and MEMS manufacturing links needs to be strengthened urgently; in the key capabilities of future sensor development, the multi-sensing fusion of hardware, software algorithms, low power consumption, and intelligence are generally lacking in China.
  According to data from market consulting agency Yole, the world's top 30 companies in the MEMS field account for 80% of the industry's economic profits, while only four local companies in China, including Goertek, AAC Technologies, and Wuxi Meixin, have made the top 30.
  "From an industrial perspective, independent research and development cannot be overemphasized." In Sun Yuwang's view, mergers and acquisitions can indeed accelerate the development of the industry, but based on the success rate of mergers and acquisitions only 20%, if you want to develop China's sensor industry, To be based on independent research and development.
  Based on his own experience, Xue Songsheng, chairman and CEO of Duowei Technology, believes that China has a greater gap with the international advanced level in sensor processing and manufacturing. In this regard, Sun Yuwang believes that manufacturing is an inevitable hurdle for the leap-forward development of China's sensor industry. "Domestic-designed products cannot be manufactured in China. They must be manufactured in Europe, America, Japan and South Korea. This leads to high costs and severely affects competitiveness. If Chinese sensors want to be internationally competitive, they must speed up the construction of their own manufacturing capabilities." Sun Yuwang He and Xue Songsheng both stated that based on the enlightenment of Bosch and others, the IDM model is a better model for the development of China's sensor industry.
  Fortunately, SMIC has already achieved mass production of oscillators, accelerometers, microphones, pressure sensors and other products. Radio frequency devices have already been shipped, and gyroscopes are also under development.
  Liu Zewen, a professor at the Institute of Microelectronics of Tsinghua University, said that packaging has become a bottleneck in China's sensor development. The current challenge is: how to package RF MEMS sensors, package MEMS (microelectromechanical system), IC (integrated circuit) and wireless communication (wireless) into SOC chips, and meet the requirements of "low power consumption, low cost, and small size". "And other requirements.
 
  MEMS sensors welcome new opportunities
  In a list of "12 disruptive technologies that determine the future economy", the Internet of Things, advanced robots, and autonomous vehicles are all on the list, and the core and foundation of these technologies are sensors. "In the robot, the most important thing is the sensor." said Li Lijun, executive vice president and chairman of Cixing Co., Ltd.
  By integrating MEMS (Micro Electro Mechanical System) and integrated circuits, MEMS sensors are becoming a new opportunity for sensor development. According to data from research institutions cited by Sun Yuwang, BCC Research predicts that the global sensor market will exceed US$150 billion by 2019. Among them, the MEMS market will reach a scale of 14 billion U.S. dollars, and China will occupy half of this market.
  In Liu Zewen's view, MEMS sensors will become an important technology in the Internet of Things and the information age. In the face of future 5G communication needs, RF MEMS sensors will become a better solution and an important integrated technology.
  However, Liu Zewen reminded at the same time that the vague concept may cause China's MEMS sensors to "get up early and catch up late" again, and move towards the "old road" of backwardness. "At present, there is a phenomenon in the industry. People say that MEMS sensors refer to pure sensors, but this may be biased. MEMS sensors are the integration of microelectromechanical systems and sensors. This is a more complex and integrated technology than a single sensor." Failure to recognize this may result in deviation from the mainstream direction and actual demand in R&D and industrialization.
  It is worth noting that platform construction is becoming the focus of industry attention and practice. At this summit forum, Gao Teng, president of Shanghai Micro-Tech International Cooperation Center ("SIMTAC"), said that SIMTAC will refer to IMEC to build a characteristic financial technology platform, and through innovative business models and one-stop technical support services, Small and medium start-ups in the industry have reduced the "three highs" (high input costs, high technology thresholds, and high risks). As an IC design company and one-stop service provider, Brite Semiconductor has established in-depth cooperation with world-renowned IP/EDA leaders Synopsys, Cadence, and Mentor to provide one-stop IP platform resources for small and medium-sized design companies.
  In addition, the Shanghai Institute of Microtechnology Industry will build the country’s first 8-inch "Beyond Moore" R&D pilot line, deploying MEMS, RF, silicon-based III-V, 3D integration, MR magnetic sensing, power, and biology. Process and measurement equipment, and develop a complete and reliable process. It is reported that the R&D line is already undergoing interior decoration, and it is planned to conduct equipment commissioning early next year.

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